Jazz Archived "In the News" from 2005

Jazz Launches BCD Process for Power Management and Analog Markets

12/13/05

Jazz Semiconductor announced the availability of 0.5 micron Bipolar CMOS DMOS (BCD) process technology targeted for power management integrated circuits (ICs) and amplifiers & drivers required for consumer applications. BCD processes incorporate into a single foundry process flow: bipolar, for analog control; CMOS, for digital control; and DMOS, for handling the high currents required for managing on-chip or system power. The combined process is suited to address the emerging power requirements of both consumer and handheld electronics.

Foundry Offers Bipolar CMOS DMOS Process for Power Management Market

12/13/05

The BCD process technology being offered by Jazz has been in fabrication for over ten years, making Jazz one of the leading foundries to bring this technology into the mainstream for fabless power and analog IC companies looking to differentiate their products through the incorporation of analog, digital and complex power functions. BCD processes provide features that enable higher levels of integration, smaller size, and better efficiency than general foundry offerings. A significant number of analog-centric fabless and fab-lite companies have already designed into the BCD processes which are used for wireless and consumer electronics such as cell phones, personal computers, DVD players and recorders, hard disk drives, portable audio players and gaming devices.

A Foundry Comes To California

12/13/05
by Chris Kraeuter

The chip-foundry business may be dominated by large firms based in Taiwan and China, but a small player in -- of all places -- Southern California is carving out its own niche. From its headquarters in Newport Beach, Calif., Jazz has built its business around making chips used in communications and networking products. The emphasis on specific markets is critical for the company. Jazz CTO Paul Kempf says the factory is full and business is good, thanks to the company's focus on high-growth areas, such as power management. "They certainly are looking at the right markets," says Joanne Itow, managing director and foundry analyst with Semico Research.

Jazz to Develop SiGe BiCMOS Communications ICs

12/13/05

Bristol, England communications IC provider Phyworks Ltd. has tapped specialty CMOS wafer foundry Jazz Semiconductor to develop next-generation physical layer products for WAN, LAN, SAN and FTTH applications on Jazz's 0.35-micron and 0.18-micron SiGe BiCMOS processes. Tim Esparon, VP of manufacturing operations at Phyworks said in a statement that Jazz was chosen because of the focus on high-speed process technologies along with a long-term roadmap that aligned with Phyworks' product needs.

Jazz Semiconductor to fab 180nm SiGe BiCMOS chips for Phyworks

12/13/05

Jazz Semiconductor is to fabricate a range of IC devices for Phyworks that include physical layer products for WAN, LAN, SAN and FTTH applications. Jazz Semiconductor's 0.35 and 0.18 micron Silicon Germanium (SiGe) BiCMOS processes will be used to design high-speed networking ICs, including transimpedance amps (TIAs) and highly integrated laser drivers and limiting amplifiers. "We chose Jazz as our foundry partner for the flexibility, availability, service and support the company provides," said Tim Esparon, VP of manufacturing operations.

Two New Jazz Semiconductor BCD Processes Expand Possibilities for Fabless Companies Semiconductor Production

12/9/05

Jazz BCD process technologies will incorporate into a single foundry flow what are normally three different process types: bipolar, for analog control; CMOS, for digital control; and DMOS, for handling high currents. This capability had previously been limited to IDMs. Semico's spin: Although Jazz has provided a variety of specialty CMOS processes, it has perhaps been best known as a SiGe Fab. The availability of its new BCD processes demonstrates its commitment to expand beyond its core business of high speed analog and RF into the emerging power management and high voltage markets. It also enables fabless companies to develop new products for rapidly growing markets where they previously had no manufacturing source.

WiSpry and Jazz Partner for Cellular MEMS

12/9/05

Microelectromechanical-systems (MEMS) developer WiSpry and wafer foundry Jazz Semiconductor have formed a partnership to create RF CMOS-based MEMS products. The partnership will blend WiSpry's digitally tunable capacitor devices and Jazz's advanced semiconductor processes, with cellular communications applications in mind. WiSpry president and CEO, Jeff Hilbert, notes "RF-MEMS devices will be a disruptive element in the design of future RF systems." He explains the importance of working with Jazz: "Our success in bringing this exciting technology to market depends on our ability to leverage existing semiconductor processes." The companies are co-developing techniques for commercial wafer level sealing of RF-MEMS devices in order to provide low-cost, high-volume devices.

Jazz expands with high voltage BCD process

12/08/05
by John Walko

LONDON -- Wafer foundry Jazz Semiconductor has started offering a 0.5 micron Bipolar CMOS DMOS (BCD) process for suppliers of power management and high voltage analog devices. Jazz plans to continue expanding its roadmap for BCD smart-power, high voltage CMOS and complementary bipolar processes into its core 0.35 micron and 0.18 micron platforms. These already enable highly integrated transceiver and power amplifier devices.

WiSpry and Jazz Partner on RF-MEMS for Cellular Handsets and Mobile Comms

12/2/05

"RF MEMS is a relatively new area for foundry semiconductor development and we are excited at the prospect of bringing this technology to market in a commercial process," said Paul Kempf, Jazz chief technology and strategy officer. "Our partnership with WiSpry will help enable innovative tunable MEMS process and device technologies, complementing the range of leading-edge, high-volume RF technologies at Jazz. Integrated RF-MEMS-enabled tunable solutions address the needs of the rapidly growing cellular handset and mobile communications markets."

12/2/05

Specialty wafer foundry Jazz Semiconductor announced it will manufacture highly integrated RF-MEMS devices for WiSpry Inc. using its leading-edge RF-CMOS processes. The two companies plan to integrate RF-MEMS digitally tunable capacitors and other functions into active silicon circuitry, enabling a roadmap to higher levels of integration with RF circuitry such as low noise amplifiers (LNAs), power amplifiers (PAs) and transceiver technology. The companies have already demonstrated the feasibility of commercially manufacturing WiSpry's digitally tunable capacitor devices in Jazz Semiconductor's 200-mm wafer fab.

Partnership to create RF-MEMS for cellular handsets

WiSpry, developer of RF micro-electromechanical systems (RF-MEMS) for the wireless industry, and Jazz Semiconductor have partnered to create innovative RF-MEMS offerings using Jazz's RF-CMOS processes. The program has successfully demonstrated the feasibility of commercially manufacturing WiSpry's digitally tunable capacitor devices into Jazz Semiconductor's 200 mm wafer fab and provides commercial availability of highly integrated RF-MEMS devices built on Jazz's processes.

Virtual versus vertical
How will DFM change the foundries?

12/1/2005
By Geoffrey James

According to Boris Petrov, managing partner at the Petrov Group, a strategy consulting firm. "Some of the emerging foundry players are pursuing the analog, RF and high-voltage markets, reflecting the emergence of power management, wireless and analog startups," he says, citing the example of Jazz Semiconductor, a privately owned foundry specializing in TV tuners, consumer-segment high-voltage/power management and MEMS/cellular integration. "The smaller foundries are leveraging existing, mature process nodes, by incorporating specialty features to create novel architectures and levels of analog integration not achievable at the larger foundries," he adds.

WiSpry and Jazz to Create RF-MEMS for Use in Handsets and Mobile Communications Devices

12/4/2005

WiSpry, a developer of radio frequency micro-electro-mechanical systems (RF-MEMS) tunable components and modules for the wireless industry, and Jazz Semiconductor, an independent wafer foundry focused on specialty complementary metal oxide semiconductor (CMOS) process technologies, have partnered to RF-MEMS offerings using Jazz's RF-CMOS processes. The companies plan to integrate RF-MEMS digital capacitors and other functions into active silicon circuitry, enabling a roadmap to higher levels of integration with RF circuitry such as low noise amplifiers (LNAs), power amplifiers (PAs) and transceiver technology.

SiGe BiCMOS Plays a Growing Role in the Mobile Platform
Lower costs and advancements in SiGe BiCMOS offer significant benefits to the wireless community
by Paul Kempf

12/1/2005

The dominance of SiGe BiCMOS in RF transceivers for mobile platforms is evident when looking inside most of today's leading cellular phones. Today's situation developed despite the relatively limited access to SiGe BiCMOS at the beginning of the design cycle for the chips in current phones, which commenced about 24 to 36 months ago. Now, with the much broader access to, lower costs associated with and continued design advantages of pure-play foundry technology that is well-suited to common radio architectures, there are good indicators of continued growth for SiGe BiCMOS in cell phones and other mobile platforms.

SiGe BiCMOS RFIC designed entirely within integrated design environment

12/1/2005

AWR has announced that the company's Analog Office design suite, a software product developed specifically for analog and RFIC design, has recently been used by a major Japanese electronics manufacturer to successfully design a 5.8GHz RFIC in an advanced silicon germanium (SiGe) bipolar complementary metal oxide semiconductor (BiCMOS) process from Jazz Semiconductor.

Jazz Partners With Xpedion

10/27/05

Jazz Semiconductor and Xpedion Design Systems have entered into a partnership to deliver a model and simulation environment for next generation RFIC design, combining Jazz's CMOS process technologies and Xpedion's RFIC simulation tools. Jazz said that the combination will make dramatic improvements in completing chip tape outs on schedule and increase first time design success for RF Systems on a Chip.

Xpedion, Jazz partner to deliver qualified design environment for RFIC design

10/27/05

EDA tools supplier Xpedion Design Systems, Inc. and Jazz have partnered to deliver a qualified model and simulation environment for next-generation RFIC design.

"Meeting tight specifications and manufacturing reliably in high volume are critical for today's consumer-oriented RFIC designs," said Pete Rodriguez, chief executive officer of Xpedion Design Systems. "Jazz, a leading RFIC foundry, has continued to support both the quality of models delivered to customers as well as reliable manufacturing capabilities for high volume ramp."

Jazz, Xpedion partner on RFIC design environment

10/25/05

Xpedion Design Systems Inc. and Jazz Semiconductor announced a partnership to deliver a qualified model and simulation environment for next generation radio frequency (RF) IC design.

According to the companies, fabless RFIC semiconductor companies are faced with very short design cycles and increasing integration rates due to the pressures of the consumer marketplace. Jazz and Xpedion say they provide the components necessary to reduce design spins and meet high volume targets.

Foundries Provide Enabling Solutions for the Fast Growing RFCMOS Market

October 11, 2005

Jazz Semiconductor announced the availability of their process design kits for its 130nm RFCMOS process. Jazz is offering a unique aluminum process that provides a low cost alternative for those products that don't require the more expensive copper interconnects. The Jazz process is targeted for analog markets such as multi-standard TV tuners and integrated demodulators, cellular and wireless LAN transceivers with digital power control integration and almost any other design requiring RF or analog SOC integration.

0.18µm Process Platform

October 2005

Jazz Semiconductor's 0.18µm process enables integrated analog, RF and power functions on a single 0.18µm platform. The platform is suited for applications where analog or RF performance is the dominating factor, and future integration requires more complex analog, high voltage or higher density analog components. Applications such as power management integration, power amplifier integration, radio frequency tuning for digital broadcast or high performance audio are all target markets for the platform.

The Power of China

October 10, 2005
by Jessica Davis

Access to capacity in China and the Asian marketplace is just as important to analog semiconductor companies as it is to digital. "China is just the obvious place to expand," said Paul Kempf, Jazz CTO. "We helped them bring up their 8-inch fabs." And Jazz brought its mixed-signal and RF technologies, including its bipolar CMOS and Silicon Germanium process technology. "The effort resulted in China's first SiGe operation, and Jazz was also the first to produce telephone transceivers in China," Kempf said.

Foundries cross design line

October 10, 2005
by Ron Wilson

According to Paul Kempf, Jazz CTO, "In our world [mixed-signal and RF wafer manufacturing] we can't expect customers to build their own design infrastructure. We have to give it to them." For Kempf, that means silicon-tested IP for the basic building blocks that are necessary to an AMS design but don't differentiate it. It also means getting involved in architectural decisions, when those decisions will have technology implications. "We are building process expertise," Kempf said. "But, really, you can't just be process technology guys anymore."

Jazz Looks to Broader Market

October 7, 2005
by Jessica Davis

Jazz Semiconductor is moving from its nascent stage of serving as a foundry for Silicon Germanium analog applications to broadening its offerings with an eye towards power management and automotive. "We are trying to address more and more of the analog market," Kempf said. "It marks our progression from a start-up to an early growth stage company."

Kempf has found that customers are more and more disenchanted with the number of ICs from different suppliers that go into handsets. With the Jazz approach, he said, many of those ICs can be integrated onto a single analog SoC, shrinking the footprint and lowering the costs.

Semiconductor foundry delivers next-generation RF CMOS and SiGe BiCMOS processes

October 6, 2005
by Ashok Bindra

This week at the 2005 FSA Conference, Jazz Semiconductor announced the availability of process design kits for its 0.13-micron RF CMOS process, CA13, followed by silicon germanium (SiGe) BiCMOS early next year. According to Jazz, the 0.13 micron CMOS platform is a low-cost alternative for applications that do not require the expensive copper interconnect of traditional 0.13 micron CMOS implementations for the back-end. The foundry service provider is targeting analog and RF companies that have an increasing need for low power digital integration with high performance analog and RF circuitry.

Jazz Semi adopts Legend's tools for SoC design

October 5, 2005

Jazz Semiconductor has adopted Legend Design Technology's CharFlo-Memory and MSIM tools to re-characterize on-chip memory instance models at various process, voltage and temperature (PVT) corners.

"For low-power designs, our customers need to lower power consumption, which can be achieved by minimizing the voltage supply, which is different from the voltage in corner models provided by memory compiler vendors," said Rajiv Gupta, Jazz director of IP and design services. "Therefore, timing and power models of memory instances must be re-characterized to prevent design failures and low yields."

Jazz Semiconductor Delivers Next-Generation 0.13 Micron Process Platform Focused on Advanced Analog and RF Systems on Chip

October 5, 2005

"RF System on Chip integration for low-cost wireless is a critical component of the growing portable and connected electronics markets. Jazz Semiconductor's 0.13 micron process platform provides an efficient option, enabling RF System on Chip integration," said Joanne Itow, managing director, Semico Research. "The follow-on 0.13 micron SiGe version will further enable circuit designers to achieve higher levels of integration at higher speeds."

Jazz juggles with low cost 130nm process

October 5, 2005

Jazz Semiconductor, a niche wafer foundry, is to start offering a 130nm process using aluminum rather than copper for interconnects to enable key analog and RF functions to be integrated as low power logic with high-performance analog and RF circuitry.

The roll-out of the CA13 platform precedes the release of the Jazz SBC13 SiGe BiCMOS technology that is based upon the RFCMOS process. The SBC13 technology includes all of the features of CA13 with the performance advantages of SiGe at low additional complexity.

Focus targets video distribution with UWB chip set

September 30, 2005

Focus Enhancements Inc., a video production and conversion technology developer, said it has received first silicon for its 880-Mbps ultrawideband chip from Jazz Semiconductor. The analog/RF chip is the first of a two-chip set UWB device targeting wireless video distribution and high-speed data transfers, according to Focus.

2005 FSA Suppliers Expo and Conference Features New Supplier Tracks

September 12, 2005

FSA, the voice of the global fabless business model, announces the program for the first day of the 2005 FSA Suppliers Expo and Conference, October 5, 2005. Foundry Tracks include a presentation from Paul Kempf, CTO Jazz Semiconductor, highlighting the company's focus on Analog Integration.

RF Magic Taps Jazz Semi

August 31, 2005

San Diego-based RF Magic and Newport Beach-based Jazz Semiconductor said this week that the two companies have been working together to ship radio frequency ICs to RF Magic customers. Jazz is acting as the foundry for RF Magic's RF System-on-a-Chip ICs. The companies claim they have shipped over 2 million radio frequency ICs as part of the collaboration. RF Magic develops ICs for broadband wireless access and cable satellite applications.

RF Magic Partners with Jazz to Ship over 2 Million RF ICs

August 31, 2005

RF Magic utilizes Jazz SBC35, its 0.35 micron SiGe BiCMOS process technology, to help achieve the demanding performance specifications for DVB-T television receivers. In addition to achieving higher levels of performance, Jazz process technology gives RF Magic the ability to achieve smaller die size by scaling down the analog portion of the chip using high-density passive components, which is typically a requirement for RF-based products.

RF Magic Partners With Jazz To Ship Over 2 Million RF Integrated Circuits

August 31, 2005

"We wanted a foundry partner who was strategically focused on RF silicon process technologies," said Mark Foley, RF Magic's CEO. "As an example, we used Jazz Semiconductor's specialized process platform for our latest product, the RF4000 digital terrestrial silicon tuner to develop the world's most advanced and highly integrated digital television tuner IC."

Startup integrates DVB-T tuner tasks

August 15, 2005

RF Magic has taken virtually all the circuitry required for a Digital Video Broadcast-Terrestrial tuner and integrated it onto an 8 x 8-mm quad flat no-lead IC. For the RF4000 line of DVB-T tuner chips, RF Magic has tapped Jazz Semiconductor as its partner to leverage Jazz's SiGe BiCMOS technology. "We wanted to bring satellite simplicity to TV tuners," said Rick Beale, RF Magic. "That required getting rid of the traditional 'canned' tuners, which typically measure 1.5 x 3 inches and are up to a quarter-inch thick."

Jazz Semiconductor Appoints Brent Jensen Vice President and Chief Financial Officer; Veteran Semiconductor Industry Executive Bolsters Management Team

July 7, 2005

Jazz announced the appointment of Brent Jensen as its VP and CFO. In this capacity, he will be responsible for leading all of the company's financial endeavors. Mr. Jensen has worked in the semiconductor industry for over 15 years, including various financial and senior management positions with National Semiconductor and AMI Semiconductor. During his term, AMI Semiconductor successfully completed a $600 million IPO in September 2003. Mr. Jensen received both his master of accounting degree and his bachelor's degree in accounting from Brigham Young University. He is also a certified public accountant.

Silicon-Based Tuners to Replace Canned

June 15, 2005
Jessica Davis

Xceive has introduced what it says are the world's first fully integrated multi-standard RF-to baseband transceiver ICs for televisions and set top boxes. The company began production in January, using Jazz Semiconductor as a foundry.

Jazz Targets Digital TV Tuners

June 8, 2005

Newport Beach-based Jazz Semiconductor has rolled out a specialized foundry process for digital TV tuners. The semiconductor foundry said that it is now offering a customized process for SiGe, BiCMOS, and RFCMOS focused on multi-standard silicon TV tuners in 0.18 micro and 0.35 micron. The process specifically focuses on providing low noise and high dynamic range transistors required for the TV tuner industry. The company said that it is rolling out the process to address digital TV and set-top conversion boxes.

Jazz Offers SiGe BiCMOS Processes for Digital TV Tuner Applications

June 7, 2005

Jazz is aiming to build its business in the TV tuner market, which it believes will grow with the planned increase in digital television delivery via cable, satellite, mobile, and terrestrial broadcast media. Its SiGe BiCMOS and RF CMOS processes offer low-noise, high-dynamic-range transistors that meet circuit requirements for tunability and low power RF performance. Jazz process technology gives customers the ability to achieve reductions in die size by scaling down the analog portion of the chip using high-density passive components available on its processes for silicon TV tuners.

Jazz Foundry Processes Address Emerging Digital TV Tuner Applications

June 7, 2005

"The TV Tuner market is growing rapidly, driven by a shift to digital TV broadcasts due to the FCC mandate that all terrestrial TV broadcasts be digital by 2006. This will require either a new digital TV or a set-top conversion box. In addition, the new DVB-H standard will bring digital TV to millions of cell phones and portable media centers," said Morry Marshall, vice president at Semico Research. "SiGe is an ideal solution for digital TV tuners and Jazz Semiconductor has aligned its SiGe process with digital TV tuner performance requirements."

Jazz Wins Frost and Sullivan Award

May 26, 2005

Jazz Semiconductor has been presented with the Frost and Sullivan 2005 SiGe Processes Foundry of the Year award.

Frost and Sullivan said that Jazz's significant contribution to promoting SiGe technology was to bring multi-fab modular capability to the SiGe market.

Comlent Launches RFIC Transceiver for PHS Handsets

May 17, 2005

Comlent, a fabless RFIC design house in Shanghai, has begun volume shipment of its CL3110 RFIC transceiver for PHS/PAS handsets. The transceiver is being manufactured using foundry partner Jazz Semiconductor's RF process platform.

Jazz Rolls Out 0.18um Process

May 12, 2005

Jazz has rolled out its CMOS semiconductor process at 0.18um, as the company targets integrated analog, RF, and power semiconductor designs at the foundry. Its 0.18um process allows for integration of power devices such as regulators, battery chargers, and power amplifiers with Radio Frequency Integrated Circuits (RFIC), and should serve designers of cellular phones, wireless handheld devices, consumer electronics, and displays with better integration and cheaper components.

Process Enables Integrated Analog, RF, Power Functions On Single 0.18um Platform

May 11, 2005

Jazz is addressing the next generation of integration needs in high performance analog and RF applications with its 0.18um process platform for applications where analog or RF performance is the dominating factor, and future integration requires more complex analog, high voltage, or higher density analog components.

Jazz Process Enables Integrated Analog, RF, and Power Functions on a Single 0.18um Platform

May 11, 2005

"The Jazz 0.18um platform offered an optimal feature set that allowed Micro Linear to integrate complex transceiver and power amplifier functions on a single die for key emerging wireless markets," said Brent Dix, VP of engineering at Micro Linear. "We achieved a reduced bill of materials and shrunk the die size by achieving the required levels of analog and RF performance for our circuit while incorporating moderate levels of standard digital CMOS integration."

Multimedia Apps Propel RF IC Devices

May 9, 2005
Janine Love

Jazz Semiconductor has been busy developing a specialty CMOS process that enables high levels of integration for analog and RF products (go to eeProductCenter.com for article), which has resulted in a new 17-GHz vertical-PNP module on its 0.18-micron RF-CMOS platform. According to the company, the module enables the design of analog circuits that require high voltage, complementary drive or amplification beyond the capability of standard CMOS.

SiGe Steps on the GaAs
Silicon germanium's lower cost and integration advantages are winning new markets

May 1, 2005
by Russ Arensman

Ultimately, chip makers hope to integrate numerous cell phone components, including PAs, filters, switches and perhaps even transceivers, onto the same chip. "Nobody's quite there yet," says Paul Kempf, chief technology officer for SiGe foundry manufacturer Jazz Semiconductor, "but the drive is there to look at all of the pieces and create a path for their integration."

Micro Linear, Jazz Semiconductor Partner to Fab PHS Tranceiver Using SiGe BiCMOS

April 12, 2005

Micro Linear has selected as its foundry partner for the manufacture of its ML1900 PHS transceiver. Aimed at the technology's growing Chinese market and operating in the 1.9GHz PHS band, the transceiver employs the Jazz 0.35-um silicon germanium (SiGe) BiCMOS platform (SBC35), integrating receiver, transmitter, synthesizer, and power amplifier functions into a single-chip format, available in production volumes.

Jazz Semiconductor Joins California's Fab Owners Association

April 5, 2005

SiGe foundry Jazz Semiconductor has joined the California-based Fab Owners Association, a not-for-profit international association for semiconductor device manufacturers. Jazz is the first pure-play foundry to join the FOA.

Vertical PNP module advances CMOS integration

April 14, 2005
Frank Bartos

Pushing beyond the capability of standard CMOS-based analog circuit design, Jazz Semiconductor recently announced availability of a 17 GHz Vertical PNP module on its 0.18-micron RFCMOS platform. The new module advances analog circuit design especially for high voltage, complementary drive, or amplification requirements. Vertical PNP (VPNP) module reportedly enables greater levels of integration than are currently available with existing CMOS, RFCMOS, and BiCMOS products.

Seeking a partner -- In capacity hunt, fabless find a buyer's market

April 4, 2005
David Lammers

There, too, TSMC faces stiff competition. "About 15 percent of the total semiconductor market is analog ICs," said Paul Kempf, chief technology officer at specialty foundry Jazz Semiconductor. "When a foundry focuses on that, they serve it differently than the companies, like TSMC, that are targeting 90-nm design rules."

Kempf said Jazz's success is due to its support infrastructure. "We have invested quite heavily in bipolar modeling, in simulation kits and models, so our customers can turn their designs quickly."

CMOS process offers high integration

March 10 2005
Janine Love
eeProduct Center

Jazz announced the availability of a 17GHz vertical PNP module on its 0.18µm RFCMOS platform. Jazz developed the new module to address a market requirement for advanced analog integration and is designed on the company's RFCMOS platform that supports advanced SiGe NPN transistor modules.

Airoha refines wireless LAN transceiver for cost and space

March 02, 2005
Mike Clendenin

Airoha Technology Corp. has made small but noteworthy changes to its 802.11a/b/g wireless LAN transceiver by embedding dual-band power amplifiers. The company used Jazz Semiconductor's
0.35-micron silicon germanium BiCMOS process to integrate the power amplifiers, which it is focusing attention on to boost transceiver coverage.


'Fab club' signs up Jazz, readies fab-tool trading board

March 02, 2005
Mark LaPedus

The recently-formed Fab Owners Association (FOA) has signed up its first member in the foundry business – Jazz Semiconductor Inc.

Jazz Expands CMOS Process Offerings

February 18, 2005

Jazz has enhanced its CMOS process offerings for integrated analog and mixed signal semiconductors. Jazz has added a 17GHz Vertical PNP module for its 0.18um RFCMOS process designed for applications such as disk drive pre-amplifiers or laser drivers, which previously were not able to be integrated onto CMOS chips.

Comlent Begins Volume Shipment of RF PA for European DECT Standard

February 28, 2005

Comlent, a fabless radio-frequency integrated circuit (RFIC) design house has begun volume shipment of an RF power amplifier (PA) targeted for the Digital Enhanced Cordless Telephony (DECT) standard in the European market. The Comlent PA operates at 1.9 GHz and utilizes Jazz Semiconductor's 0.35 um BiCMOS process.

Gbit contender enters ultrawideband fray

Feb 14, 2005
Patrick Mannion

Pulse-Link has first silicon for its transceiver from its foundry, Jazz Semiconductor.

Jazz adds Vertical PNP module to RF CMOS process, enabling
complementary circuits

February 16, 2005

Jazz announced availability of a 17GHz Vertical PNP module on its 0.18um RFCMOS platform. The process feature was developed to address a market requirement for advanced analog integration and is designed on the company's RFCMOS platform that supports advanced SiGe NPN transistor modules.

Selecting semiconductor technology for wireless products
There are technology, cost, and performance tradeoffs among digital CMOS,
RFCMOS, and SiGe BiCMOS

February 2005
By Paul Kempf, CTO and CMO, Jazz Semiconductor

The number of wireless standards and their potential single-chip combinations raises many questions about the right process technology for implementing next-generation products. There are technology, cost, and performance tradeoffs among digital CMOS, RFCMOS, and SiGe BiCMOS, but the argument in favor of digital CMOS as a more viable solution for wireless designs because of manufacturing scale is incomplete and demands further examination in terms of the functional scaling that is possible in standard versus specialty CMOS-based technologies.

SEE Archived "In the News" from 2004

SEE Archived "In the News" from 2003