Jazz Semiconductor offers its customers quick and low-cost access to high performance processes through a Multiproject Wafer (MPW) program. The Jazz MPW program provides customers with the opportunity to prototype their upcoming designs on one of Jazz's leading-edge technology platforms and provides the customer with a vehicle to get new designs into the market quickly, without incurring the full cost of a complete mask set.

Jazz Semiconductor MPW Schedule

Updated 08/11/08
SBC18
A0814
SiGe BiCMOS 0.18um
5/27/2008
8/28/2008
SBC35
A0842
SiGe BiCMOS 0.35um
6/10/2008
8/25/2008
SBC18
A0853
SiGe BiCMOS 0.18um
6/17/2008
9/19/2008
CA18
A0977
RFCMOS 0.18um
7/8/2008
9/22/2008
SBC18
A0841
SiGe BiCMOS 0.18um
7/15/2008
10/17/2008
BCD35
A0942
Bi-CMOS-DMOS 0.35um
7/22/2008
9/29/2008
SBC18
A0854
SiGe BiCMOS 0.18um
8/12/2008
11/14/2008
SBC35
A0972
SiGe BiCMOS 0.35um
8/19/2008
11/3/2008
BCD25
A0951
Bi-CMOS-DMOS 0.25um
9/9/2008
11/14/2008
CA18
A0840
RFCMOS 0.18um
9/16/2008
12/4/2008
SBC18
A0864
SiGe BiCMOS 0.18um
9/23/2008
12/30/2008
SBC35
A0954
SiGe BiCMOS 0.35um
9/30/2008
12/15/2008
SBC18
A0950
SiGe BiCMOS 0.18um
10/21/2008
1/23/2009
BCD35
A0943
Bi-CMOS-DMOS 0.35um
11/4/2008
1/19/2009
SBC35
A0973
SiGe BiCMOS 0.35um
11/11/2008
1/26/2009
SBC18
A0974
SiGe BiCMOS 0.18um
11/18/2008
2/26/2009
BCD25
A0971
Bi-CMOS-DMOS 0.25um
12/2/2008
2/12/2009
SBC18
A0978
SiGe BiCMOS 0.18um
12/9/2008
3/23/2009
CA18
A0984
RFCMOS 0.18um
12/16/2008
3/11/2009
SBC18
A01015
SiGe BiCMOS 0.18um
1/13/2009
4/17/2009
SBC18
A01016
SiGe BiCMOS 0.18um
2/10/2009
5/15/2009
If Polyimide is needed, the published Fab-Out date will be 5 days later

The MPW program runs on a monthly basis, allowing customers multiple opportunities to tape-out their designs. Jazz will provide a customer with a 5x5mm tile for their design (the customer can purchase multiple tiles) and offers subdicing of the tile for an incremental charge. The customer receives approximately 50 tiles upon completion of the MPW.

NOTE: Jazz Semiconductor contracts with third parties for purposes of performing various wafer processing, including but not limited to such services as backgrind, bumping, dicing, epitaxy or other processing steps. Customer agrees that Jazz Semiconductor may release the MPW wafers to such third party contractors for performance of such services, provided that such third party contractors are bound by an obligation of confidentiality no less restrictive than the terms currently in place between Jazz Semiconductor and Customer and are also under obligation to return all wafers or wafer remnants to Jazz Semiconductor upon completion of its services.

Dates are subject to change without notice - a purchase order needs to be placed and accepted to guarantee a particular tape-in date.

 

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